Summary:
Join the XUV Optics group at the University of Twente for a two-year postdoctoral position focusing on the physics of wafer bonding, crucial for 3D chip integration. Collaborate closely with industry and contribute to the next generation of semiconductor technologies.
Designation:
Postdoctoral Researcher
Table:
| Detail | Information |
|---|---|
| Research Area | Wafer Bonding Physics, 3D Chip Integration |
| Location | University of Twente, Netherlands |
| Eligibility/Qualification | PhD in relevant fields (Materials Science, etc.) |
| Deadline for Application | June 21, 2026 |
Research Area:
- Wafer Bonding Physics
- 3D Chip Integration
- Surface Science
- Advanced Metrology
- Semiconductor Process Development
Location:
University of Twente, Netherlands
Eligibility/Qualification:
- PhD in Materials Science, Surface Science, Applied Physics, Physical Chemistry, Nanotechnology, Mechanical Engineering, or related field.
- Experience in experimental research on surfaces, interfaces, thin films, or semiconductor-related materials.
- Familiarity with characterization techniques (AFM, WLI, contact-angle measurements, XPS, FTIR, etc.).
- Strong analytical skills and ability to work independently.
- Proficiency in English; strong communication skills.
Job Description:
This position entails developing and validating experimental methods for wafer bonding, focusing on the interplay between surface properties and bonding performance. Responsibilities include:
- Conducting wafer bonding measurements.
- Engaging in data analysis and physical interpretation.
- Collaborating with academic and industrial partners.
- Contributing to predictive relations between wafer surface properties and bonding performance.
How to Apply:
Interested candidates should submit their application by clicking the “Apply now” button on the university’s job portal, including:
- CV
- Motivation letter
- List of publications (if applicable)
Last Date for Application:
June 21, 2026
