Summary
The University of Twente invites applications for a fully funded 4-year PhD position focused on advanced manufacturing and thermal management for next-generation chip packaging. The project aims to develop innovative solutions to manage heat in high-performance computing and AI hardware.
PhD Scholarship in Multi-Material Additive Manufacturing for Advanced Chip Cooling, University of Twente, Netherlands
Designation
PhD Candidate
Research Area
- Multi-Material Additive Manufacturing
- Thermal Management
- Semiconductor Packaging
- Materials Science
Location
University of Twente, Netherlands
Eligibility/Qualification
| Criteria | Details |
|---|---|
| Education | Master’s degree in Mechanical Engineering, Materials Science, or a related discipline |
| Skills | Strong interest in additive manufacturing, thermal management, semiconductor packaging |
| Experience | Familiarity with material characterization techniques like SEM, EBSD, and XRD (preferred) |
| Language | Proficiency in English (spoken and written) |
| Other | Strong analytical and problem-solving skills; ability to work both independently and collaboratively |
Job Description
The PhD candidate will:
- Develop metal-silicon interfaces and integrated cooling solutions using Laser Powder Bed Fusion (LPBF).
- Investigate interfacial physics affecting thermal transport across interfaces.
- Work with characterization methods including SEM, EBSD, XRD, and thermal analysis.
- Fabricate and validate cooling demonstrators for chip cooling applications.
- Collaborate in an interdisciplinary environment with researchers and industrial partners.
How to Apply
To apply, please send your application via the “Apply Now” button, including:
- CV
- Motivation letter
- List of publications (if applicable)
For more details, you may contact Dr. Davoud Jafari at davoud.jafari@utwente.nl.
Last Date for Application
July 5, 2026
