PhD Position in Advanced Chip Cooling at University of Twente, Netherlands

Summary

The University of Twente is offering a fully funded 4-year PhD position focused on developing ultra-efficient cooling technologies for advanced semiconductor packaging. This cutting-edge project, named UltraCool, combines materials science, additive manufacturing, thermal engineering, and semiconductor integration to address the critical thermal management challenges in high-performance computing and AI hardware. The successful candidate will work on novel metal–silicon interfaces and integrated cooling solutions using Laser Powder Bed Fusion (LPBF).

PhD Position in Multi-Material Additive Manufacturing for Advanced Chip Cooling at University of Twente

Designation

PhD Candidate

Key Information

Research Area

• Multi-material Additive Manufacturing
• Advanced Chip Cooling / Thermal Management
• Materials Science (Metal–Silicon Interfaces, Interlayer Alloys)
• Laser Powder Bed Fusion (LPBF)
• Semiconductor Packaging
• Thermodynamic Design
• Interfacial Physics

Location

University of Twente, Enschede, Netherlands

Eligibility/Qualification

We are looking for a highly motivated, enthusiastic, and self-driven researcher who meets the following qualifications:

• A Master’s degree in Mechanical Engineering or Materials Science and Engineering or another relevant engineering/science discipline.
• Strong interest in additive manufacturing, materials development, thermal management, and semiconductor packaging.
• Experience with materials characterization techniques such as SEM, EBSD, XRD, thermal characterization methods, and mechanical testing is highly desirable.
• Familiarity with additive manufacturing processes, particularly Laser Powder Bed Fusion, is an advantage.
• Knowledge of metallurgy or computational materials engineering is beneficial.
• Ability to work independently and collaboratively within an interdisciplinary research environment.
• Strong analytical, experimental, and problem-solving skills.
• Motivation to contribute to both fundamental research and industrially relevant technology development.
• Excellent communication skills and proficiency in English, both spoken and written.

Scholarship Description

This PhD project aims to tackle the thermal bottleneck in future electronics by designing novel interlayer alloys, developing multi-material Laser Powder Bed Fusion (LPBF) processes, and integrating cooling functionality directly into package-level demonstrators. The research will involve:

• Thermodynamic design of interlayer alloy feedstocks.
• Powder production and characterization.
• Multi-material LPBF process optimization.
• Investigation of interfacial physics governing residual stress, defect formation, and thermal transport across copper–silicon interfaces.
• Utilizing characterization methods including SEM, EBSD, XRD, thermal conductivity analysis, and thermo-mechanical testing.
• Fabrication and validation of package-level cooling demonstrators for direct and indirect chip cooling applications.

The successful candidate will work in a highly interdisciplinary and international environment with academic researchers and industrial partners in semiconductor packaging, powder production, sensing technologies, and thermal management. The position offers excellent opportunities for high-impact scientific research and developing industrially relevant technologies.

Our Offer Includes:

• A fully funded 4-year PhD position in an ambitious and internationally recognized research environment.
• Excellent working conditions and an exciting scientific environment.
• Gross monthly salary of € 3,059 in the first year, increasing to € 3,881 in the fourth year.
• Excellent benefits including a holiday allowance of 8% of the gross annual salary, a year-end bonus of 8.3%, and a solid pension scheme.
• Opportunities for professional and personal development with a tailored training program.
• Good secondary conditions in accordance with the collective labor agreement CAO-NU for Dutch universities.

How to Apply

Interested candidates should submit their application via the online application portal, including the following documents:

1. A cover letter (maximum one A4 page) emphasizing your motivation, relevant expertise, and interest in the project.
2. A detailed CV including academic achievements, research experience, publications (if applicable), and contact information of at least three references.
3. Academic transcripts from your Bachelor’s and Master’s studies.

For more information, you may contact Dr. Davoud Jafari at davoud.jafari@utwente.nl.

Last Date for Apply

November 1, 2026

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