Summary:
A fully funded 4-year PhD position is offered at the University of Twente (Faculty of Engineering Technology) to develop ultra-efficient cooling technologies for advanced semiconductor packaging. The project focuses on multi-material Laser Powder Bed Fusion (LPBF), interlayer alloys, and direct/indirect chip cooling demonstrators to address high heat fluxes in AI and HPC hardware. The position provides a competitive Dutch CAO salary, extensive facilities, and opportunities for interdisciplinary collaboration with academic and industrial partners.
PhD Position in Multi-Material Additive Manufacturing for Advanced Chip Cooling (UltraCool), University of Twente, Netherlands
Designation:
PhD Candidate (4-year position) in Mechanical Engineering / Materials Science and Engineering
Table:
- Vacancy: PhD Position in Multi-Material Additive Manufacturing for Advanced Chip Cooling
- Location: University of Twente, Enschede, Netherlands
- Salary (gross/monthly): €3,059 in year 1 → €3,881 in year 4
- Contract: Full-time, 4 years
- Deadline: 5 July 2026
- Contact: Dr. Davoud Jafari (davoud.jafari@utwente.nl)
- Website/Application: Apply via the official vacancy portal (Apply Now)
Research Area:
- Multi-material additive manufacturing (LPBF)
- Development of interlayer alloys and multi-material feedstocks
- Thermodynamic design and characterization of copper–silicon interfaces
- Thermal management and integrated cooling in direct chip packaging
- Interfacial physics, residual stress, defect formation, and thermal transport
- Package-level cooling demonstrators (direct and indirect cooling)
Location:
- University of Twente, Enschede, Netherlands
- Department: Faculty of Engineering Technology (ET)
Eligibility/Qualification:
- Master’s degree in Mechanical Engineering, Materials Science and Engineering, or a related engineering/science discipline
- Strong interest in additive manufacturing, materials development, thermal management, and semiconductor packaging
- Desirable: Experience with SEM, EBSD, XRD, thermal characterization, mechanical testing
- Advantageous: Familiarity with Laser Powder Bed Fusion; knowledge of metallurgy or computational materials engineering
- Skills: Independent and collaborative work style, strong analytical and problem-solving abilities, good English communication
- Other: Willingness to engage in interdisciplinary research and industrial collaboration
Job Description:
- Conduct research on ultra-efficient cooling for advanced semiconductor packaging
- Design and develop novel interlayer alloys and feedstocks for multi-material LPBF
- Optimize multi-material LPBF processes and investigate interfacial physics (residual stress, defects, thermal transport at copper–silicon interfaces)
- Fabricate and validate package-level cooling demonstrators for direct and indirect chip cooling
- Utilize characterization techniques (SEM, EBSD, XRD, thermal conductivity analysis) and thermo-mechanical testing
- Collaborate with academic researchers and industrial partners in semiconductor packaging, powder production, sensing technologies, and thermal management
- Contribute to publication of high-impact scientific results and development of industrially relevant technologies
How to Apply:
- Prepare and submit online application with:
- CV
- Motivation letter
- List of publications (if any)
- Deadline: 5 July 2026
- For more information contact: Dr. Davoud Jafari (davoud.jafari@utwente.nl)
- Selection steps include online/in-person interviews; first interview around July 10, 2026
- Apply via the vacancy portal (Apply Now)
Last Date to Apply:
- 5 July 2026
Notes:
- The position is fully funded under the Dutch CAO for Universities (CAO-NU)
- Salary includes standard benefits such as 8% holiday allowance and 8.3% year-end bonus
- University of Twente promotes a sustainable, inclusive, and human-centered research environment
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