Summary
The University of Twente is offering a challenging 2-year postdoctoral position in the XUV Optics group. The successful candidate will investigate the detailed physics behind wafer bonding for next-generation 3D chip integration, combining surface science, advanced metrology, and semiconductor process development in close collaboration with industry.
PostDoc Position on Wafer Bonding Physics for 3D Chip Integration
Designation
Postdoctoral Researcher (PostDoc)
Research Area
- Wafer Bonding Physics
- 3D Chip Integration
- Surface Science
- Advanced Metrology
- Semiconductor Process Development
Location
University of Twente, Enschede, Netherlands
Eligibility/Qualification
Your Profile
- PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field.
- Experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials.
- Familiarity with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods.
- Interest in connecting experimental results to physical models and quantitative data analysis.
- Enjoy hands-on experimental work and ability to work accurately with advanced laboratory equipment.
- Creative mindset, independent worker, and motivated to address challenging scientific problems with industrial relevance.
- Good team spirit and enjoy working in an interdisciplinary environment with academic and industrial partners.
- Proficient in English and able to communicate results clearly in meetings, reports, and scientific publications.
Job Description
Wafer-to-wafer bonding is a crucial technology for future 3D chip integration, enabling faster, more compact, and energy-efficient semiconductor devices. However, the detailed mechanisms governing bonding quality are not yet fully understood, particularly the interplay between surface properties, wafer morphology, and bonding performance, which is often optimized empirically.
In this postdoctoral project, you will:
- Develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way.
- Conduct wafer bonding measurements and integrate them with advanced surface metrology.
- Utilize analysis techniques such as AFM, WLI, contact-angle, XPS, and infrared metrology.
- Work within the XUV Optics group at the University of Twente, embedded in the MESA+ Institute for Nanotechnology.
- Engage in hands-on experimental work, data analysis, physical interpretation, and close interaction with industrial partners.
- Contribute to a scientifically challenging and industrially relevant topic, aiming to establish predictive relationships between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.
Our Offer
- Appointment for a maximum of 2 years full-time in a stimulating scientific environment.
- Salary in accordance with the collective labour agreement for Dutch universities (CAO-NU).
- Gross salary between €3,706 (step 0) and €5,760 (step 12) per month, depending on experience and qualifications (based on full-time employment).
- Excellent benefits, including an 8% holiday allowance, an 8.3% year-end bonus, and a solid pension scheme.
- Free access to sports facilities on campus.
- A minimum of 232 leave hours for full-time employment (38-hour workweek), with an additional 96 leave hours annually for a practical 40-hour workweek.
- Excellent support for research and facilities for professional and personal development.
- Encouragement of high responsibility and independence, alongside collaboration with colleagues and partners.
- Family-friendly institution offering parental leave and career support for partners.
How to Apply
Interested candidates should submit their application via the ‘Apply now’ button before the deadline. The application should include:
- A cover letter (maximum 2 pages A4) emphasizing specific interest, qualifications, and motivations for the position.
- A Curriculum Vitae, including a list of all courses attended and grades obtained, and, if applicable, a list of publications and references.
- Proof of English proficiency (IELTS or TOEFL), if available.
- Contact details for two references.
For more information, you may contact Dr.ir. Wesley van den Beld at w.t.e.vandenbeld@utwente.nl.
Last Date for Apply
October 17, 2026
Apply Link
