Summary
The University of Twente invites applications for a two-year postdoctoral position in the XUV Optics group, focusing on wafer bonding physics necessary for next-generation 3D chip integration.
PostDoc Position on Wafer Bonding Physics for 3D Chip Integration, University of Twente, Netherlands
Designation
Postdoctoral Researcher
| Detail | Information |
|---|---|
| Research Area | Wafer bonding physics, surface science, semiconductor process development |
| Location | University of Twente, Enschede, Netherlands |
| Eligibility/Qualification | – PhD in materials science, surface science, applied physics, physical chemistry, or related fields – Experience in experimental research on surfaces, interfaces, and thin films – Familiarity with characterization techniques (AFM, WLI, XPS, etc.) |
| Job Description | The successful candidate will investigate wafer bonding mechanisms, develop experimental methods, conduct measurements, and combine them with advanced surface metrology. The position involves collaboration with industry partners and contributes to predictive relations between wafer surface properties and bonding performance. |
| How to Apply | Interested candidates should send their application including a CV and motivation letter via the ‘Apply now’ button on our careers page. For inquiries, contact Dr.ir. Wesley van den Beld at w.t.e.vandenbeld@utwente.nl. |
| Last Date to Apply | June 21, 2026 |
About the Position
This position offers a stimulating research environment, competitive salary, and excellent benefits, including a holiday allowance and access to professional development resources.
Additional Information
The University of Twente prides itself on fostering a collaborative and diverse research community. We encourage applications from candidates of all backgrounds, particularly those underrepresented in science and engineering.
Start your journey in advancing semiconductor technology with us!
