Summary:
The University of Twente is inviting applications for a challenging 2-year postdoctoral position in the XUV Optics group. The successful candidate will investigate the physics behind wafer bonding technology, crucial for the next generation of 3D chip integration. This project blends advanced metrology, surface science, and semiconductor process development, closely collaborating with industry partners.
PostDoc Position on Wafer Bonding Physics for 3D Chip Integration, University of Twente, Netherlands
Designation:
Postdoctoral Researcher
Job Details Table:
| Category | Details |
|---|---|
| Research Area | Wafer Bonding Physics for 3D Chip Integration |
| Location | University of Twente, Netherlands |
| Salary | €4,241 – €5,538 (gross/monthly) |
| Work Hours | 38 – 40 hours per week |
| Contract Duration | Maximum 2 years |
| Application Deadline | June 21, 2026 |
Eligibility/Qualification:
- PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or related fields.
- Experience in experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor materials.
- Familiarity with characterization techniques (AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry).
Job Description:
The candidate will:
- Develop and validate experimental methods to study wafer bonding quantitatively.
- Conduct hands-on experimental work and data analysis.
- Connect experimental results to physical models and quantitative data.
- Collaborate with industrial partners, contributing to a project of scientific and industrial relevance.
- Communicate findings effectively in meetings, reports, and publications.
How to Apply:
Interested candidates should apply via the ‘Apply now’ button on the website, including a CV and a motivation letter or list of publications. For further inquiries, contact Dr. Wesley van den Beld at w.t.e.vandenbeld@utwente.nl.
Last Date for Application:
June 21, 2026
