Summary
The University of Twente is offering a challenging 2-year postdoctoral position in the XUV Optics group. This project focuses on investigating the detailed physics behind wafer bonding, a key enabling technology for future 3D chip integration. The role involves developing and validating experimental methods to study wafer bonding in a quantitative and physics-based way, combining surface science, advanced metrology, and semiconductor process development in close collaboration with industry. The aim is to establish predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.
PostDoc Position on Wafer Bonding Physics for 3D Chip Integration
Designation
PostDoc
Research Area
- Wafer Bonding Physics
- 3D Chip Integration
- Surface Science
- Advanced Metrology
- Semiconductor Process Development
- Materials Science
- Applied Physics
- Physical Chemistry
- Nanotechnology
- Mechanical Engineering
Location
University of Twente, Enschede, Netherlands
Eligibility/Qualification
Education
- PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field.
Experience
- Experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials.
- Familiarity with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods.
Skills & Qualities
- Interest in connecting experimental results to physical models and quantitative data analysis.
- Enjoy hands-on experimental work and ability to work accurately with advanced laboratory equipment.
- Creative mindset, independent worker, and motivated to address challenging scientific problems with industrial relevance.
- Good team spirit and enjoys working in an interdisciplinary environment with academic and industrial partners.
- Proficient in English and able to communicate results clearly in meetings, reports, and scientific publications.
Job Description
In this postdoctoral project, you will:
- Develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way.
- Work on wafer bonding measurements and combine these with advanced surface metrology.
- Utilize analysis techniques such as AFM, WLI, contact-angle, XPS, and infrared metrology.
- Work within the XUV Optics group at the University of Twente, embedded in the MESA+ Institute for Nanotechnology.
- Combine hands-on experimental work, data analysis, and physical interpretation.
- Engage in close interaction with industrial partners.
- Contribute to a scientifically challenging and industrially relevant topic, aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.
How to Apply
Interested candidates should send their application via the ‘Apply now’ button before the deadline. The application must include:
- A cover letter (maximum 2 pages A4), emphasizing specific interest, qualifications, and motivations for the position.
- A Curriculum Vitae, including a list of all courses attended and grades obtained, and, if applicable, a list of publications and references.
- Proof of English proficiency (IELTS or TOEFL), if available.
- Contact details for two references.
For more information regarding this position, you may contact Dr.ir. Wesley van den Beld at w.t.e.vandenbeld@utwente.nl.
Last Date for Apply
October 10, 2026
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